This report studies the Solder Paste Inspection (SPI) System market, Solder Paste Inspection is mainly done to check the solder paste deposits in the Printed Circuit Board (PCB) manufacturing process. It is observed that most of the solder joint defects in a PCB assembly are because of improper solder paste printing. With the help of solder paste inspection (SPI), you can reduce the defects related to soldering by a considerable amount.

Importance of Solder Paste Inspection Process
Here are some of the key points of information, which prove the importance of SPI process:
Improves PCB Quality & Performance: This process makes use of advanced equipment for precise inspection. Angle cameras are used to take 3D pictures, which are very helpful in measuring the alignment and volume of the solder paste. This helps improve the yield, as well as the print quality. Furthermore, it helps improve the performance of the PCBs.

Advanced Equipment for Better Control & Monitoring: As said earlier, angle cameras are used, which produce clear 3D pictures. Unlike the traditional cameras, 3D cameras are capable of capturing the height of the solder paste printed. This facilitates precise measurement of the solder paste volume. Thus, with the help of SPI coupled with automated optical inspection, manufacturers can easily monitor and control the component placement and solder paste printing processes.

Helps Reduce Solder Errors: Important information about the printing process can be obtained by doing the solder paste inspection. It gives a clear idea about the causes of defects, thus allowing you to make the necessary changes and reduce the errors to a minimum.

Numerous studies have been performed over the last few years proving that up to 70% of all SMD solder joint issues, can be traced back to the solder paste printing process. These printing errors may be caused by incorrect printer setup, stencil damage, stencil design or type, solder paste type, solder paste conditions or a collection of several issues.
The global Solder Paste Inspection (SPI) System market concentration rate is high and dominated by several players from Korea, Taiwan, Japan, United States and Germany; Koh Young, MirTec Ltd, PARMI Corp and Pemtron are from Korea; Test Research, Inc (TRI) and Jet Technology from Taiwan; CyberOptics Corporation, Machine Vision Products (MVP), Caltex Scientific and ASC International from United States; and Viscom AG and Vi TECHNOLOGY from Europe. In 2017, Koh Young and Test Research, Inc (TRI) occupied more than 60 percent of global market.
Currently, In-line SPI systems are dominating the market, due to the superior performance and the market demand. The SPI system market is mainly driven by the demand from Automotive and Consumer Electronics; other end market like communications, aerospace and medical fields will play more and more role in future.

The Global Solder Paste Inspection (SPI) System Market size was xxx million USD with a CAGR xx % from 2018- 2022. It will stretch to xxx million USD in 2023 with a CAGR of xx % from 2023 - 2030.

As the report focuses on global Solder Paste Inspection (SPI) System Market, mainly in Europe and Asia Pacific, North America, Middle East and Africa, and South America. This report segmented the Market on the basis of regions, manufacturers, applications, and type.

in addition, this report introduces Market competition situation among the vendors and company profile, besides, Market price analysis and value chain features are covered in this report.

In Market segmentation by manufacturers, the report covers the following companies-

Koh Young (Korea)
CyberOptics Corporation
Test Research, Inc (TRI) (Taiwan)
MirTec Ltd (Korea)
PARMI Corp (Korea)
Viscom AG (Germany)
ViTrox (Malaysia)
Vi TECHNOLOGY (France)
Mek (Marantz Electronics) (Japan)
CKD Corporation (Japan)
Pemtron (Korea)
SAKI Corporation (Japan)
Machine Vision Products (MVP) (US)
Caltex Scientific (US)
ASC International (US)
Sinic-Tek Vision Technology (China)
Shenzhen JT Automation Equipment (China)
Jet Technology (Taiwan)

In Market segmentation by geographical regions, the report has analyzed the following regions-
North America (USA, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Columbia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

In Market segmentation by types covers:

In-line SPI System
Off-line SPI System
In Market segmentation by applications :

Automotive Electronics
Consumer Electronics
Industrials
Others

Apart from the drivers, restraints, and opportunities, the report also offers competitive landscape, including various growth strategies adopted by profiled players for establishing significant position in the industry. The segmentation included in the comprehensive report will help respectable manufacturers to set up their processing units in the regions and increase their global presence. This would also benefit the industry and increase the company\'s product portfolio.

The research provides answers to the following key questions:
• What is the estimated growth rate and Market share and size of the Solder Paste Inspection (SPI) System Market for the forecast period 2023 - 2030?
• What are the driving forces in the Solder Paste Inspection (SPI) System Market for the forecast period 2023 - 2030?
• Who are the prominent Market players and how have they gained a competitive edge over other competitors?
• What are the Market trends influencing the progress of the Solder Paste Inspection (SPI) System industry worldwide?
• What are the major challenges and threats restricting the progress of the industry?
• What opportunities does the Market hold for the prominent Market players?
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Note – In order to provide more accurate market forecast, all our reports will be updated before delivery by considering the impact of COVID-19.

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