High-Speed Board-to-Board Connectors Market Size By Application, Industry Analysis Report, Regional Outlook (Europe, North America, Asia Pacific, Middle East & Africa, And South America), Growth Potential, Price Trends, Competitive Market Share & Forecast 2023 - 2030 (Recession Impact Analysis)
ID : MRU_
51890 | Date :
Jan, 2023 | Pages :
186 | Region : Global |
Publisher : RI
Board-to-board (BTB) connectors are used to connect printed circuit boards (PCB), electronic components that contain a conductive pattern printed on the surface of the insulating base in an accurate and repeatable manner. Each terminal on a BTB connector is connected to a PCB. A BTB connector includes housing and a specific number of terminals. The terminal is made from a conductive material (mostly copper alloy), and plated to improve conductivity and antirust. Terminals transmit the current/signal between PCBs connected by BTB; the housing is made of insulating material (mostly plastic).
North America, Europe and China are major regions produce Board-to-board Connectors in the world, accounting for more than 66% of the world. APAC dominates the global demand market for Board-to-board Connectors and the trend is anticipated to continue for a foreseeable future. APAC is expected to account for the largest share of the global Board-to-board connector market in 2017. The demand for industrial Internet of Thing is high in the APAC region with special focus on process automation. In countries such as Japan and China where the automobile market has opportunities supported by electric vehicles, the consumption of connectors is high. The APAC region is a huge hub for consumer electronics market which in turn increases the demand for connectors in this region.
The Global High-Speed Board-to-Board Connectors Market had reached xxx million USD with a CAGR xx from 2018-2022. Later on, it will go to xxx million USD in 2023 with a CAGR xx % from 2023-2030.
In the global High-Speed Board-to-Board Connectors Market, This report focuses particularly in North America, South America, Europe and Asia-Pacific, and Middle East and Africa. This report classifies the Market on the basis of application, type, regions, and manufactures.
In Market segmentation by manufacturers, the report covers the following companies-
TE Connectivity
Samtec
Amphenol
Molex
Fujitsu
Hirose Electric
JST
Joint Admissions Exercise (JAE)
Delphi
Harting
Foxconn
ERNI Electronics
Kyocera
Yamaichi Electronics
Advanced Interconnect
Unimicron Technology
In Market segmentation by geographical regions, the report has analysed the following regions-
North America (USA, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Columbia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
In Market segmentation by types :
<1.00 mm
1.00 mm-2.00 mm
> 2.00 mm
In Market segmentation by applications :
Transportation
Consumer Electronics
Communications
Industries
Military
Other
The research provides answers to the following key questions:
• What is the estimated growth rate and Market share and size of the High-Speed Board-to-Board Connectors Market for the forecast period 2023-2030?
• What are the driving forces in the High-Speed Board-to-Board Connectors Market for the forecast period 2023-2030?
• Who are the prominent Market players and how have they gained a competitive edge over other competitors?
• What are the Market trends influencing the progress of the High-Speed Board-to-Board Connectors industry worldwide?
• What are the major challenges and threats restricting the progress of the industry?
• What opportunities does the Market hold for the prominent Market players? Any special requirements about this report, please let us know and we can provide custom report.
Note – In order to provide more accurate market forecast, all our reports will be updated before delivery by considering the impact of COVID-19.
Table of Contents
1 Report Overview
1.1 Research Scope
1.2 Major Manufacturers Covered in This Report
1.3 Market Segment by Type
1.3.1 Global High-Speed Board-to-Board Connectors Market Size Growth Rate by Type (2020-2030)
1.3.2 <1.00 mm
1.3.3 1.00 mm-2.00 mm
1.3.4 > 2.00 mm
1.4 Market Segment by Application
1.4.1 Global High-Speed Board-to-Board Connectors Market Share by Application (2020-2030)
1.4.2 Transportation
1.4.3 Consumer Electronics
1.4.4 Communications
1.4.5 Industries
1.4.6 Military
1.4.7 Other
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Production and Capacity Analysis
2.1.1 Global High-Speed Board-to-Board Connectors Production Value 2015-2030
2.1.2 Global High-Speed Board-to-Board Connectors Production 2015-2030
2.1.3 Global High-Speed Board-to-Board Connectors Capacity 2015-2030
2.1.4 Global High-Speed Board-to-Board Connectors Marketing Pricing and Trends
2.2 Key Producers Growth Rate (CAGR) 2020-2030
2.2.1 Global High-Speed Board-to-Board Connectors Market Size CAGR of Key Regions
2.2.2 Global High-Speed Board-to-Board Connectors Market Share of Key Regions
2.3 Industry Trends
2.3.1 Market Top Trends
2.3.2 Market Drivers
3 Market Share by Manufacturers
3.1 Capacity and Production by Manufacturers
3.1.1 Global High-Speed Board-to-Board Connectors Capacity by Manufacturers
3.1.2 Global High-Speed Board-to-Board Connectors Production by Manufacturers
3.2 Revenue by Manufacturers
3.2.1 High-Speed Board-to-Board Connectors Revenue by Manufacturers (2018-2022)
3.2.2 High-Speed Board-to-Board Connectors Revenue Share by Manufacturers (2018-2022)
3.2.3 Global High-Speed Board-to-Board Connectors Market Concentration Ratio (CR5 and HHI)
3.3 High-Speed Board-to-Board Connectors Price by Manufacturers
3.4 Key Manufacturers High-Speed Board-to-Board Connectors Plants/Factories Distribution and Area Served
3.5 Date of Key Manufacturers Enter into High-Speed Board-to-Board Connectors Market
3.6 Key Manufacturers High-Speed Board-to-Board Connectors Product Offered
3.7 Mergers & Acquisitions, Expansion Plans
4 Market Size by Type
4.1 Production and Production Value for Each Type
4.1.1 <1.00 mm Production and Production Value (2018-2022)
4.1.2 1.00 mm-2.00 mm Production and Production Value (2018-2022)
4.1.3 > 2.00 mm Production and Production Value (2018-2022)
4.2 Global High-Speed Board-to-Board Connectors Production Market Share by Type
4.3 Global High-Speed Board-to-Board Connectors Production Value Market Share by Type
4.4 High-Speed Board-to-Board Connectors Ex-factory Price by Type
5 Market Size by Application
5.1 Overview
5.2 Global High-Speed Board-to-Board Connectors Consumption by Application
6 Production by Regions
6.1 Global High-Speed Board-to-Board Connectors Production (History Data) by Regions 2015-2020
6.2 Global High-Speed Board-to-Board Connectors Production Value (History Data) by Regions
6.3 United States
6.3.1 United States High-Speed Board-to-Board Connectors Production Growth Rate 2015-2020
6.3.2 United States High-Speed Board-to-Board Connectors Production Value Growth Rate 2015-2020
6.3.3 Key Players in United States
6.3.4 United States High-Speed Board-to-Board Connectors Import & Export
6.4 European Union
6.4.1 European Union High-Speed Board-to-Board Connectors Production Growth Rate 2015-2020
6.4.2 European Union High-Speed Board-to-Board Connectors Production Value Growth Rate 2015-2020
6.4.3 Key Players in European Union
6.4.4 European Union High-Speed Board-to-Board Connectors Import & Export
6.5 China
6.5.1 China High-Speed Board-to-Board Connectors Production Growth Rate 2015-2020
6.5.2 China High-Speed Board-to-Board Connectors Production Value Growth Rate 2015-2020
6.5.3 Key Players in China
6.5.4 China High-Speed Board-to-Board Connectors Import & Export
6.6 Rest of World
6.6.1 Japan
6.6.2 Korea
6.6.3 India
6.6.4 Southeast Asia
7 High-Speed Board-to-Board Connectors Consumption by Regions
7.1 Global High-Speed Board-to-Board Connectors Consumption (History Data) by Regions
7.2 United States
7.2.1 United States High-Speed Board-to-Board Connectors Consumption by Type
7.2.2 United States High-Speed Board-to-Board Connectors Consumption by Application
7.3 European Union
7.3.1 European Union High-Speed Board-to-Board Connectors Consumption by Type
7.3.2 European Union High-Speed Board-to-Board Connectors Consumption by Application
7.4 China
7.4.1 China High-Speed Board-to-Board Connectors Consumption by Type
7.4.2 China High-Speed Board-to-Board Connectors Consumption by Application
7.5 Rest of World
7.5.1 Rest of World High-Speed Board-to-Board Connectors Consumption by Type
7.5.2 Rest of World High-Speed Board-to-Board Connectors Consumption by Application
7.5.1 Japan
7.5.2 Korea
7.5.3 India
7.5.4 Southeast Asia
8 Company Profiles
8.1 TE Connectivity
8.1.1 TE Connectivity Company Details
8.1.2 Company Description and Business Overview
8.1.3 Production and Revenue of High-Speed Board-to-Board Connectors
8.1.4 High-Speed Board-to-Board Connectors Product Introduction
8.1.5 TE Connectivity Recent Development
8.2 Samtec
8.2.1 Samtec Company Details
8.2.2 Company Description and Business Overview
8.2.3 Production and Revenue of High-Speed Board-to-Board Connectors
8.2.4 High-Speed Board-to-Board Connectors Product Introduction
8.2.5 Samtec Recent Development
8.3 Amphenol
8.3.1 Amphenol Company Details
8.3.2 Company Description and Business Overview
8.3.3 Production and Revenue of High-Speed Board-to-Board Connectors
8.3.4 High-Speed Board-to-Board Connectors Product Introduction
8.3.5 Amphenol Recent Development
8.4 Molex
8.4.1 Molex Company Details
8.4.2 Company Description and Business Overview
8.4.3 Production and Revenue of High-Speed Board-to-Board Connectors
8.4.4 High-Speed Board-to-Board Connectors Product Introduction
8.4.5 Molex Recent Development
8.5 Fujitsu
8.5.1 Fujitsu Company Details
8.5.2 Company Description and Business Overview
8.5.3 Production and Revenue of High-Speed Board-to-Board Connectors
8.5.4 High-Speed Board-to-Board Connectors Product Introduction
8.5.5 Fujitsu Recent Development
8.6 Hirose Electric
8.6.1 Hirose Electric Company Details
8.6.2 Company Description and Business Overview
8.6.3 Production and Revenue of High-Speed Board-to-Board Connectors
8.6.4 High-Speed Board-to-Board Connectors Product Introduction
8.6.5 Hirose Electric Recent Development
8.7 JST
8.7.1 JST Company Details
8.7.2 Company Description and Business Overview
8.7.3 Production and Revenue of High-Speed Board-to-Board Connectors
8.7.4 High-Speed Board-to-Board Connectors Product Introduction
8.7.5 JST Recent Development
8.8 Joint Admissions Exercise (JAE)
8.8.1 Joint Admissions Exercise (JAE) Company Details
8.8.2 Company Description and Business Overview
8.8.3 Production and Revenue of High-Speed Board-to-Board Connectors
8.8.4 High-Speed Board-to-Board Connectors Product Introduction
8.8.5 Joint Admissions Exercise (JAE) Recent Development
8.9 Delphi
8.9.1 Delphi Company Details
8.9.2 Company Description and Business Overview
8.9.3 Production and Revenue of High-Speed Board-to-Board Connectors
8.9.4 High-Speed Board-to-Board Connectors Product Introduction
8.9.5 Delphi Recent Development
8.10 Harting
8.10.1 Harting Company Details
8.10.2 Company Description and Business Overview
8.10.3 Production and Revenue of High-Speed Board-to-Board Connectors
8.10.4 High-Speed Board-to-Board Connectors Product Introduction
8.10.5 Harting Recent Development
8.11 Foxconn
8.12 ERNI Electronics
8.13 Kyocera
8.14 Yamaichi Electronics
8.15 Advanced Interconnect
8.16 Unimicron Technology
9 Market Forecast
9.1 Global Market Size Forecast
9.1.1 Global High-Speed Board-to-Board Connectors Capacity, Production Forecast 2020-2030
9.1.2 Global High-Speed Board-to-Board Connectors Production Value Forecast 2020-2030
9.2 Market Forecast by Regions
9.2.1 Global High-Speed Board-to-Board Connectors Production and Value Forecast by Regions 2020-2030
9.2.2 Global High-Speed Board-to-Board Connectors Consumption Forecast by Regions 2020-2030
9.3 United States
9.3.1 Production and Value Forecast in United States
9.3.2 Consumption Forecast in United States
9.4 European Union
9.4.1 Production and Value Forecast in European Union
9.4.2 Consumption Forecast in European Union
9.5 China
9.5.1 Production and Value Forecast in China
9.5.2 Consumption Forecast in China
9.6 Rest of World
9.6.1 Japan
9.6.2 Korea
9.6.3 India
9.6.4 Southeast Asia
9.7 Forecast by Type
9.7.1 Global High-Speed Board-to-Board Connectors Production Forecast by Type
9.7.2 Global High-Speed Board-to-Board Connectors Production Value Forecast by Type
9.8 Consumption Forecast by Application
11 Opportunities & Challenges, Threat and Affecting Factors
11.1 Market Opportunities
11.2 Market Challenges
11.3 Porters Five Forces Analysis
12 Key Findings
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer
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