Semiconductor Wafer Grinding Equipment Market Size By Application, Industry Analysis Report, Regional Outlook (Europe, North America, Asia Pacific, Middle East & Africa, And South America), Growth Potential, Price Trends, Competitive Market Share & Forecast 2023 - 2030 (Financial Impact Analysis)
ID : MRU_
44471 | Date :
Jan, 2023 | Pages :
186 | Region : Global |
Publisher : RI
Foundries are the primary end-user of the semiconductor fabrication market due to the steady adoption of fabless business model. The market will witness increasing demand for devices such as memory, logic, discrete, analog, sensor, and opto devices. Subsequently, the vendors must ensure and enhance their equipment quality to cater to the growing demand.
APAC will be the major revenue contributor to the semiconductor fabrication market owing to the large number of semiconductor foundries located in China, Taiwan, South Korea, and Japan. The construction of fabs and steady adoption of fabless business model will further supplement the growth of the semiconductor wafer grinding equipment market in APAC.
The Global Semiconductor Wafer Grinding Equipment Market touched xxx million USD with a CAGR xx % from 2018-2022 around the world. In the future, it is predicted to reach xxx million USD in 2023 with a CAGR xx % from 2023-2030.
As the report focuses on global Semiconductor Wafer Grinding Equipment Market, mainly in Europe and Asia Pacific, North America, Middle East and Africa, and South America. This report segmented the Market on the basis of regions, manufacturers, applications, and type.
in addition, this report introduces Market competition situation among the vendors and company profile, besides, Market price analysis and value chain features are covered in this report.
In Market segmentation by manufacturers, the report covers the following companies-
Applied Materials
Ebara Corporation
Lapmaster
Logitech
Entrepix
Revasum
Tokyo Seimitsu
Logomatic
In Market segmentation by geographical regions, the report has analyzed the following regions- North America (USA, Canada and Mexico) Europe (Germany, France, UK, Russia and Italy) Asia-Pacific (China, Japan, Korea, India and Southeast Asia) South America (Brazil, Argentina, Columbia etc.) Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
In Market segmentation by types covers:
Cylindrical Grinding
Surface Grinding
Other
In Market segmentation by applications :
Foundries
Memory Manufacturers
IDMs
Apart from the drivers, restraints, and opportunities, the report also offers competitive landscape, including various growth strategies adopted by profiled players for establishing significant position in the industry. The segmentation included in the comprehensive report will help respectable manufacturers to set up their processing units in the regions and increase their global presence. This would also benefit the industry and increase the company\'s product portfolio.
The research provides answers to the following key questions:
• What is the estimated growth rate and Market share and size of the Semiconductor Wafer Grinding Equipment Market for the forecast period 2023-2030?
• What are the driving forces in the Semiconductor Wafer Grinding Equipment Market for the forecast period 2023-2030?
• Who are the prominent Market players and how have they gained a competitive edge over other competitors?
• What are the Market trends influencing the progress of the Semiconductor Wafer Grinding Equipment industry worldwide?
• What are the major challenges and threats restricting the progress of the industry?
• What opportunities does the Market hold for the prominent Market players? Any special requirements about this report, please let us know and we can provide custom report.
Note – In order to provide more accurate market forecast, all our reports will be updated before delivery by considering the impact of COVID-19.
Table of Contents
1 Report Overview
1.1 Research Scope
1.2 Major Manufacturers Covered in This Report
1.3 Market Segment by Type
1.3.1 Global Semiconductor Wafer Grinding Equipments Market Size Growth Rate by Type (2020-2030)
1.3.2 Cylindrical Grinding
1.3.3 Surface Grinding
1.3.4 Other
1.4 Market Segment by Application
1.4.1 Global Semiconductor Wafer Grinding Equipments Market Share by Application (2020-2030)
1.4.2 Foundries
1.4.3 Memory Manufacturers
1.4.4 IDMs
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Production and Capacity Analysis
2.1.1 Global Semiconductor Wafer Grinding Equipments Production Value 2015-2030
2.1.2 Global Semiconductor Wafer Grinding Equipments Production 2015-2030
2.1.3 Global Semiconductor Wafer Grinding Equipments Capacity 2015-2030
2.1.4 Global Semiconductor Wafer Grinding Equipments Marketing Pricing and Trends
2.2 Key Producers Growth Rate (CAGR) 2020-2030
2.2.1 Global Semiconductor Wafer Grinding Equipments Market Size CAGR of Key Regions
2.2.2 Global Semiconductor Wafer Grinding Equipments Market Share of Key Regions
2.3 Industry Trends
2.3.1 Market Top Trends
2.3.2 Market Drivers
3 Market Share by Manufacturers
3.1 Capacity and Production by Manufacturers
3.1.1 Global Semiconductor Wafer Grinding Equipments Capacity by Manufacturers
3.1.2 Global Semiconductor Wafer Grinding Equipments Production by Manufacturers
3.2 Revenue by Manufacturers
3.2.1 Semiconductor Wafer Grinding Equipments Revenue by Manufacturers (2018-2022)
3.2.2 Semiconductor Wafer Grinding Equipments Revenue Share by Manufacturers (2018-2022)
3.2.3 Global Semiconductor Wafer Grinding Equipments Market Concentration Ratio (CR5 and HHI)
3.3 Semiconductor Wafer Grinding Equipments Price by Manufacturers
3.4 Key Manufacturers Semiconductor Wafer Grinding Equipments Plants/Factories Distribution and Area Served
3.5 Date of Key Manufacturers Enter into Semiconductor Wafer Grinding Equipments Market
3.6 Key Manufacturers Semiconductor Wafer Grinding Equipments Product Offered
3.7 Mergers & Acquisitions, Expansion Plans
4 Market Size by Type
4.1 Production and Production Value for Each Type
4.1.1 Cylindrical Grinding Production and Production Value (2018-2022)
4.1.2 Surface Grinding Production and Production Value (2018-2022)
4.1.3 Other Production and Production Value (2018-2022)
4.2 Global Semiconductor Wafer Grinding Equipments Production Market Share by Type
4.3 Global Semiconductor Wafer Grinding Equipments Production Value Market Share by Type
4.4 Semiconductor Wafer Grinding Equipments Ex-factory Price by Type
5 Market Size by Application
5.1 Overview
5.2 Global Semiconductor Wafer Grinding Equipments Consumption by Application
6 Production by Regions
6.1 Global Semiconductor Wafer Grinding Equipments Production (History Data) by Regions 2015-2020
6.2 Global Semiconductor Wafer Grinding Equipments Production Value (History Data) by Regions
6.3 United States
6.3.1 United States Semiconductor Wafer Grinding Equipments Production Growth Rate 2015-2020
6.3.2 United States Semiconductor Wafer Grinding Equipments Production Value Growth Rate 2015-2020
6.3.3 Key Players in United States
6.3.4 United States Semiconductor Wafer Grinding Equipments Import & Export
6.4 European Union
6.4.1 European Union Semiconductor Wafer Grinding Equipments Production Growth Rate 2015-2020
6.4.2 European Union Semiconductor Wafer Grinding Equipments Production Value Growth Rate 2015-2020
6.4.3 Key Players in European Union
6.4.4 European Union Semiconductor Wafer Grinding Equipments Import & Export
6.5 China
6.5.1 China Semiconductor Wafer Grinding Equipments Production Growth Rate 2015-2020
6.5.2 China Semiconductor Wafer Grinding Equipments Production Value Growth Rate 2015-2020
6.5.3 Key Players in China
6.5.4 China Semiconductor Wafer Grinding Equipments Import & Export
6.6 Rest of World
6.6.1 Japan
6.6.2 Korea
6.6.3 India
6.6.4 Southeast Asia
7 Semiconductor Wafer Grinding Equipments Consumption by Regions
7.1 Global Semiconductor Wafer Grinding Equipments Consumption (History Data) by Regions
7.2 United States
7.2.1 United States Semiconductor Wafer Grinding Equipments Consumption by Type
7.2.2 United States Semiconductor Wafer Grinding Equipments Consumption by Application
7.3 European Union
7.3.1 European Union Semiconductor Wafer Grinding Equipments Consumption by Type
7.3.2 European Union Semiconductor Wafer Grinding Equipments Consumption by Application
7.4 China
7.4.1 China Semiconductor Wafer Grinding Equipments Consumption by Type
7.4.2 China Semiconductor Wafer Grinding Equipments Consumption by Application
7.5 Rest of World
7.5.1 Rest of World Semiconductor Wafer Grinding Equipments Consumption by Type
7.5.2 Rest of World Semiconductor Wafer Grinding Equipments Consumption by Application
7.5.1 Japan
7.5.2 Korea
7.5.3 India
7.5.4 Southeast Asia
8 Company Profiles
8.1 Applied Materials
8.1.1 Applied Materials Company Details
8.1.2 Company Description and Business Overview
8.1.3 Production and Revenue of Semiconductor Wafer Grinding Equipments
8.1.4 Semiconductor Wafer Grinding Equipments Product Introduction
8.1.5 Applied Materials Recent Development
8.2 Ebara Corporation
8.2.1 Ebara Corporation Company Details
8.2.2 Company Description and Business Overview
8.2.3 Production and Revenue of Semiconductor Wafer Grinding Equipments
8.2.4 Semiconductor Wafer Grinding Equipments Product Introduction
8.2.5 Ebara Corporation Recent Development
8.3 Lapmaster
8.3.1 Lapmaster Company Details
8.3.2 Company Description and Business Overview
8.3.3 Production and Revenue of Semiconductor Wafer Grinding Equipments
8.3.4 Semiconductor Wafer Grinding Equipments Product Introduction
8.3.5 Lapmaster Recent Development
8.4 Logitech
8.4.1 Logitech Company Details
8.4.2 Company Description and Business Overview
8.4.3 Production and Revenue of Semiconductor Wafer Grinding Equipments
8.4.4 Semiconductor Wafer Grinding Equipments Product Introduction
8.4.5 Logitech Recent Development
8.5 Entrepix
8.5.1 Entrepix Company Details
8.5.2 Company Description and Business Overview
8.5.3 Production and Revenue of Semiconductor Wafer Grinding Equipments
8.5.4 Semiconductor Wafer Grinding Equipments Product Introduction
8.5.5 Entrepix Recent Development
8.6 Revasum
8.6.1 Revasum Company Details
8.6.2 Company Description and Business Overview
8.6.3 Production and Revenue of Semiconductor Wafer Grinding Equipments
8.6.4 Semiconductor Wafer Grinding Equipments Product Introduction
8.6.5 Revasum Recent Development
8.7 Tokyo Seimitsu
8.7.1 Tokyo Seimitsu Company Details
8.7.2 Company Description and Business Overview
8.7.3 Production and Revenue of Semiconductor Wafer Grinding Equipments
8.7.4 Semiconductor Wafer Grinding Equipments Product Introduction
8.7.5 Tokyo Seimitsu Recent Development
8.8 Logomatic
8.8.1 Logomatic Company Details
8.8.2 Company Description and Business Overview
8.8.3 Production and Revenue of Semiconductor Wafer Grinding Equipments
8.8.4 Semiconductor Wafer Grinding Equipments Product Introduction
8.8.5 Logomatic Recent Development
9 Market Forecast
9.1 Global Market Size Forecast
9.1.1 Global Semiconductor Wafer Grinding Equipments Capacity, Production Forecast 2020-2030
9.1.2 Global Semiconductor Wafer Grinding Equipments Production Value Forecast 2020-2030
9.2 Market Forecast by Regions
9.2.1 Global Semiconductor Wafer Grinding Equipments Production and Value Forecast by Regions 2020-2030
9.2.2 Global Semiconductor Wafer Grinding Equipments Consumption Forecast by Regions 2020-2030
9.3 United States
9.3.1 Production and Value Forecast in United States
9.3.2 Consumption Forecast in United States
9.4 European Union
9.4.1 Production and Value Forecast in European Union
9.4.2 Consumption Forecast in European Union
9.5 China
9.5.1 Production and Value Forecast in China
9.5.2 Consumption Forecast in China
9.6 Rest of World
9.6.1 Japan
9.6.2 Korea
9.6.3 India
9.6.4 Southeast Asia
9.7 Forecast by Type
9.7.1 Global Semiconductor Wafer Grinding Equipments Production Forecast by Type
9.7.2 Global Semiconductor Wafer Grinding Equipments Production Value Forecast by Type
9.8 Consumption Forecast by Application
11 Opportunities & Challenges, Threat and Affecting Factors
11.1 Market Opportunities
11.2 Market Challenges
11.3 Porters Five Forces Analysis
12 Key Findings
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer
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