Solder Ball Market Size By Regional Analysis(Europe, Asia Pacific, America, Middle East And Africa), By Demand & COVID-19 Impact Analysis, By Type, By Applications And Forecasts 2023 - 2030 (Financial Impact Analysis)
ID : MRU_
319899 | Date :
Nov, 2021 | Pages :
164 | Region : Global |
Publisher : RI
The market research report is created with a compilation of analytical research based on historic records, current statistics, and future predictions. The report contains details on the leading players operating in the Solder Ball market including various factors related to and dependent influencing the market growth.
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as ball or bumps) is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
Asia Pacific held the leading share of the market in terms of revenue in 2016. We estimate that the global market share of Solder Ball is 27.66% in Taiwan, 20.54% in Korea, 17.28% in Japan, 15% in China and 10.56% in South East Asia. Because there are many larger IC packaging (including testing) companies in these region, such as ASE, Amkor, SPIL etc. Solder Ball are most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
Senju Metal, DS HiMetal and MKE captured the top three revenue share spots in the Solder Ball market in 2016. Senju Metal dominated with 40.00% revenue share, followed by DS HiMetal with 19.14% revenue share and MKE with 7.08% revenue share.
Global Solder Ball market size will increase to 350 Million US$ by 2030, from 210 Million US$ in 2020, at a CAGR of 6.4% during the forecast period. In this study, 2023 has been considered as the base year and 2023 to 2030 as the forecast period to estimate the market size for Solder Ball.
The report is prepared using analytical methods such as SWOT (strengths, weaknesses, opportunities, and threats)) analysis, PESTEL Analysis, Porter\'s Five Force Analysis, and value chain analysis. These methods provide a clear view of the market structure and analyze competition at a global level. They also provide detailed information on each segment in the global Solder Ball market.
The aim of the report is to interpret the market sizes of various segments and countries for the forecast period. The study includes the qualitative and quantitative analysis of the market. The report analyses the Solder Ball market on a regional and global level with a deep analysis of macro-and micro-economic factors impacting the growth of the market. This report also includes market information related to the latest industry trends, market developments, and analysis of products and end users contributing to market growth. An in-depth study of the current market scenario, major driving factors, and restraining factors for the market are also included in the report.
The Solder Ball market report includes information related to market segmentation, market size and revenue forecasts, and regional forecasts along with information about the leading market players operating in the market, company revenue shares and, their recent developments. The market is classified regionally on country-level into North America, Europe, Asia Pacific, the Middle East and Africa, and South America.
Scope of the Solder Ball Market: The major competitors working in the market are:
, Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology
Market by Order Type
Lead Solder Ball
Lead Free Solder Ball
Solder Ball Data by Application
BGA
CSP & WLCSP
Flip-Chip & Others
Solder Ball Production Regions Covered in the Report are:
North America
Europe
Asia Pacific
Middle East & Africa
Rest of the World
The information about the Solder Ball market is obtained from several sources such as company websites, journals, annual reports, which were then assessed and verified by the industry experts. The information is represented in the form of diagrams, charts, pie charts, and infographics, which helps in a better understanding of the market.
Objectives of Solder Ball Market Report:
To analyze the factors driving the market growth including supply chain analysis, price analysis along with other analytical methods
To provide an in-depth analysis of the Solder Ball market with information on various segment and sub-segments
To provide a regional analysis and global analysis for the Solder Ball market size and their forecasts
To provide strategic profiles of the key players operating in the Solder Ball market, their key competencies, and market competition
To provide a competitive scenario about the key factors driving, restraining, and challenging the market growth.
The impact of COVID-19 pandemic on the Solder Ball market
Target Audiences for Solder Ball Market:
Investors
Investment Bankers
Key Consulting Companies and Advisors
Venture Capitalists
Large, Medium-sized, and Small enterprises
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